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21st IEEE International Mixed-Signal Testing Workshop
(IMSTW’16)
July 4-6, 2016
Hotel Eden Roc, Sant Feliu de Guixols, Catalunya, Spain

http://tima.imag.fr/conferences/imstw/imstw16/

Under the umbrella of the
1st IEEE Federative Event on Design for Robustness 
http://tima.imag.fr/conferences/fedfro/fedfro16 
CALL FOR PAPERS

Scope

The role of nano-electronic systems is rapidly expanding in every facet of modern life. To interact with environment and users the Integrated Circuits need analog, mixed-signal, RF or MEMS blocks. These blocks could represent a low part of the chip area but have a major impact on IC Yield and reliability. Indeed, one of the major bottlenecks nowadays for nano-electonics systems is the post-manufacturing testing of their analog, mixed-signal, RF, and MEMS functions, in order to guarantee outgoing quality while not sacrificing yield. Testing such functions is accounting for a large portion of the overall manufacturing cost.

The main rea sons include the pressing demand for zero defective parts-per-million, the increasing frequency of operation, the high levels of integration, the limited controllability and observability of embedded blocks, the integration of heterogeneous devices onto the same substrate, the requirement for specialized, high-cost equipment, the new defect mechanisms and excessive process variations occurring in advance technology nodes, the long test times, etc.

In addition to the post-manufacturing testing problem, modern safety-critical, mission-critical, and remote-controlled systems need to be equipped with self-test, concurrent error detection, and fault tolerance capabilities so as to detect early reliability hazards and guarantee reliable operation even in harsh environments. For such systems, diagnosing the sources of failures occurring in the field of operation is of vital importance, in order to apply corrective actions and to prevent failure reoccurrence.

The International Mixed-Signal Testing Workshop (IMSTW) is one of the main forums that
bring together analog, mixed-signal, RF, and MEMS the test community to discuss ideas and views on the above challenges. The scope of the workshop includes, but is not limited to, the following topics:

- Test generation
- Fault modeling and simulation
- Test metrics estimation
- Self-healing and self-adaptation
- Built-in self-test
- Design-for-test
- Fault diagnosis
- Failure analysis
- Defect characterization
- ATE technology
- Economics of test and yield optimization
- On-line test
- Fault tolerance
- Reliability and design-for-reliability

Submissions

Submissions: Submissions should be via the workshop web-site and consist of either an extended summary of at least 750 words or preferably a complete 6-page paper. The workshop will produce electronic formal proceedings with an ISBN number which will become available in the IEEE Xplore digital library.

Key Dates

Submission deadline: March 25, 2016
Notification of acceptance: May 13, 2016
Camera-ready full papers: June 03, 2016

Additional Information

A selection of papers will be invited to a special issue of Springer Journal of Electronic Testing: Theory and Applications (JETTA).

Committee
General Chair

S. Bernard, LIRMM, FR

Program Chairs

M. Barragan, TIMA, FR

W. Eisenstadt, U. Florida, USA

Local Chair

L. Balado, UPC, ES

Special Session

M. Comte, LIRMM, FR

H.-G. Stratigopoulos, LIP6, FR

Publication

K. Huang, SDSU, USA

Finance

V. Kerzérho, LIRMM, FR

Publicity

S. Mir, TIMA, FR

A. Todri-Sanial, LIRMM, FR

Program Committee

  • J. Altet, UPC, ES
  • F. Azaïs, LIRMM, FR
  • L. Balado, UPC, ES
  • I. Bell, U. of Hull, UK
  • A. Bounceur, U. of Brest, FR
  • A. Chatterjee, Georgia Tech, USA
  • M. Comte, LIRMM, FR
  • J. Dabrowski, Linkoping U, SE
  • O. Eliezer, EverSet Tech., USA
  • A. J. Gines, IMSE, ES
  • J. Goes, U. Nova de Lisboa, PT
  • N. Horta, IST Lisboa, PT
  • J. Huang, Nat. Tawan U., TW
  • H. Kerkhoff, U. Twente, NL
  • V. Kerzérho, LIRMM, FR
  • H. Kobayashi, Gunma U., JP
  • Y. Lechuga, U. Cantabria, ES
  • G. Leger, IMSE, ES
  • J. Machado da Silva, U. Porto, PT
  • Y. Makris, U. Texas Dallas, USA
  • L. Milor, Georgia Tech, USA
  • S. Mir, TIMA, FR
  • S. Natarajan, Intel, USA
  • S. Sattler, Erlangen U., DE
  • M. Slamani, Global Foundries, USA
  • H. Stratigopoulos, LIP6, FR
  • H. M. von Staudt, Dialog Sem., DE
  • S. Sunter, Mentor Graphics, USA
  • F. Taenzler, TI, USA
  • Y. Tsiatouhas, U. of Ioannina, GR
  • D. Vazquez, U. Sevilla, ES
  • T. Yamaguchi, Advantest, JP
Steering Committee
  • F. Azais, LIRMM, FR
  • K. Chakrabarty, Duke U., USA
  • J. Abraham, U. Texas Austin, USA
  • A. Chatterjee, Georgia Tech, USA
  • K.-T. Cheng, UCSB, USA
  • B. Courtois, CMP, FR
  • J.-L. Huang, N. Taiwan U., Tw
  • A. Ivanov, UBC, CA
  • B. Kaminska, Simon Frazer U., CA
  • H. Kerkhoff, U. Twente, NL
  • J. Machado da Silva, U. Porto, PT
  • S. Mir, TIMA, FR
  • M. Renovell, LIRMM, FR
  • A. Richardson, U. Lancaster, UK 


For more information, visit us on the web at: http://tima.imag.fr/conferences/imstw/imstw16/

The 21st International Mixed-Signal Testing Workshop 2016 is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC).


IEEE Computer Society- Test Technology Technical Council

TTTC CHAIR
Michael NICOLAIDIS
TIMA Laboratory - France
Tel. +33-4-765-74696
E-mail michael.nicolaidis@imag.fr

PAST CHAIR
Adit D. SINGH
Auburn University - USA
Tel. +1-334-844-1847
E-mail adsingh@eng.auburn.edu

TTTC 1ST VICE CHAIR
Chen-Huan CHIANG
Alcatel-Lucent - USA
E-mail chen-huan.chiang@alcatel-lucent.com

SECRETARY
Joan FIGUERAS
Un. Politec. de Catalunya - Spain
Tel. +34-93-401-6603
E-mail figueras@eel.upc.es

ITC GENERAL CHAIR
Michael Purtell
Intersil
- USA
Tel. +1-408-372-6015
E-mail m.purtell@ieee.org

TEST WEEK COORDINATOR
Yervant ZORIAN
Synopsys, Inc. - USA
Tel. +1-650-584-7120
E-mail Yervant.Zorian@synopsys.com

TUTORIALS AND EDUCATION
Paolo BERNARDI

Politecnico di Torino
- Italy
Tel. +39-011-564-7183
E-mail paolo.bernardi@polito.it

STANDARDS
Rohit KAPUR

Synopsys
, Inc. - USA
Tel. +1-650-934-1487
E-mail rkapur@synopsys.com

EUROPE
Giorgio DI NATALE
LIRMM - France
Tel. +33-467-41-85-01
E-mail giorgio.dinatale@lirmm.fr

MIDDLE EAST & AFRICA
Ibrahim HAJJ
American University of Beirut - Lebanon
Tel. +961-1-341-952
E-mail ihajj@aub.edu.lb

STANDING COMMITTEES
André IVANOV
University of British Columbia - Canada
Tel. +1-604-822-6936
E-mail ivanov@ece.ubc.ca

ELECTRONIC MEDIA
Giorgio DI NATALE
LIRMM - France
Tel. +33-467-41-85-01
E-mail giorgio.dinatale@lirmm.fr

 

PRESIDENT OF BOARD
Yervant ZORIAN
Synopsys, Inc. - USA
Tel. +1-650-584-7120
E-mail Yervant.Zorian@synopsys.com

SENIOR PAST CHAIR
André IVANOV
University of British Columbia - Canada
Tel. +1-604-822-6936
E-mail ivanov@ece.ubc.ca

TTTC 2ND VICE CHAIR
Rohit KAPUR

Synopsys, Inc.
- USA
Tel. +1-650-934-1487
E-mail rkapur@synopsys.com

FINANCE
Chen-Huan CHIANG
Alcatel-Lucent - USA
E-mail chen-huan.chiang@alcatel-lucent.com

IEEE DESIGN & TEST EIC
André IVANOV
U. of British Columbia - Canada
Tel. +1
E-mail ivanov@ece.ubc.ca

TECHNICAL MEETINGS
Chen-Huan CHIANG
Alcatel-Lucent
- USA
Tel. +1-973-386-6759
E-mail chenhuan@alcatel-lucent.com

TECHNICAL ACTIVITIES
Matteo SONZA REORDA
Politecnico di Torino - Italy
Tel.+39 090 7055
E-mail patrick.girard@lirmm.fr

ASIA & PACIFIC
Kazumi HATAYAMA
NAIST - Japan
Tel.+81-743-72-5221
E-mail k-hatayama@is.naist.jp

LATIN AMERICA
Victor Hugo CHAMPAC
Instituto Nacional de Astrofisica - Mexico
Tel.+52-22-470-517
E-mail champac@inaoep.mx

NORTH AMERICA
André IVANOV
University of British Columbia - Canada
Tel. +1-604-822-6936
E-mail ivanov@ece.ubc.ca

COMMUNICATIONS
Cecilia METRA
Università di Bologna - Italy
Tel. +39-051-209-3038
E-mail cmetra@deis.unibo.it

INDUSTRY ADVISORY BOARD
Yervant ZORIAN
Synopsys, Inc. - USA
Tel. +1-650-584-7120
E-mail Yervant.Zorian@synopsys.com


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